XC3S700AN-4FGG484C

Product Summary

The XC3S700AN-4FGG484C is a member of Spartan-3AN family. The XC3S700AN-4FGG484C combines the best attributes of a leading edge, low cost FPGA with nonvolatile technology across a broad range of densities. The family combines all the features of the Spartan-3A FPGA family plus leading technology in-system Flash memory for configuration and nonvolatile data storage. The XC3S700AN-4FGG484C is part of the Extended Spartan-3A family, which also includes the Spartan-3A FPGAs and the higher density Spartan-3A DSP FPGAs. The XC3S700AN-4FGG484C is excellent for space-constrained applications such as blade servers, medical devices, automotive infotainment, telematics, GPS, and other small consumer products. The Spartan-3AN FPGA internal configuration interface is completely self-contained, increasing design security. The family maintains full support for external configuration. The XC3S700AN-4FGG484C is the world’s first nonvolatile FPGA with MultiBoot, supporting two or more configuration files in one device, allowing alternative configurations for field upgrades, test modes, or multiple system configurations.

Parametrics

XC3S700AN-4FGG484C absolute maximum ratings: (1)VCCINT, Internal supply voltage: –0.5 to 1.32 V; (2)VCCAUX, Auxiliary supply voltage: –0.5 to 3.00 V; (3)VCCO, Output driver supply voltage: –0.5 to 3.75 V; (4)VREF, Input reference voltage: –0.5 to VCCO+0.5 V; (5)IIK, Input clamp current per I/O pin,–0.5 V < VIN < (VCCO + 0.5 V): ±100 mA; (6)VESD, Electrostatic Discharge Voltage: Human body model: ±2000 V; (7)Charged device model: ±500 V; Machine model: ±200 V; (8)TJ, Junction temperature: 125℃; (9)TSTG, Storage temperature: –65 to 150℃.

Features

XC3S700AN-4FGG484C features: (1)The new standard for low cost nonvolatile FPGA solutions; (2)Eliminates traditional nonvolatile FPGA limitations with the advanced 90 nm Spartan-3A device feature set; (3)Integrated robust configuration memory; (4)Plentiful amounts of nonvolatile memory available to the user; (5)Robust 100K Flash memory program/erase cycles; (6)20 years Flash memory data retention; (7)Security features provide bitstream anti-cloning protection; (8)Configuration watchdog timer automatically recovers from configuration errors; (9)Suspend mode reduces system power consumption; (10)Full hot-swap compliance; (11)Multi-voltage, multi-standard SelectIOinterface pins; (12)Abundant, flexible logic resources; (13)Hierarchical SelectRAMmemory architecture; (14)Up to eight Digital Clock Managers (DCMs); (15)Eight global clocks and eight additional clocks per each half; (16)of device, plus abundant low-skew routing; (17)Complete XilinxR ISER and WebPACK. software development system support; (18)MicroBlaze. and PicoBlaze embedded processor cores; (19)Fully compliant 32-/64-bit 33 MHz PCI technology support; (20)Low-cost QFP and BGA Pb-free (RoHS) packaging options.

Diagrams