XC5VLX50-1FFG676C

Product Summary

The XC5VLX50-1FFG676C is a member of Virtex-5 family. The XC5VLX50-1FFG676C provides the newest most powerful features in the FPGA market. Using the second generation ASMBL (Advanced Silicon Modular Block) column-based architecture, the XC5VLX50-1FFG676C contains five distinct platforms (sub-families), the most choice offered by any FPGA family. Each platform contains a different ratio of features to address the needs of a wide variety of advanced logic designs. In addition to the most advanced, high-performance logic fabric, the XC5VLX50-1FFG676C contains many hard-IP system level blocks, including powerful 36-Kbit block RAM/FIFOs, second generation 25 x 18 DSP slices, SelectIO technology with built-in digitallycontrolled impedance, ChipSync source-synchronous interface blocks, system monitor functionality, enhanced clock management tiles with integrated DCM (Digital Clock Managers) and phase-locked-loop (PLL) clock generators, and advanced configuration options. Built on a 65-nm state-of-the-art copper process technology, the XC5VLX50-1FFG676C is a programmable alternative to custom ASIC technology.

Parametrics

XC5VLX50-1FFG676C absolute maximum ratings: (1)VCCINT, Internal supply voltage relative to GND: –0.5 to 1.1 V; (2)VCCAUX, Auxiliary supply voltage relative to GND: –0.5 to 3.0 V; (3)VCCO, Output drivers supply voltage relative to GND: –0.5 to 3.75 V; (4)VBATT, Key memory battery backup supply: –0.5 to 4.05 V; (5)VREF, Input reference voltage: –0.5 to 3.75 V; (6)TSTG, Storage temperature (ambient): –65 to 150℃; (7)TSOL, Maximum soldering temperature: +220℃; (8)TJ, Maximum junction temperature: +125℃.

Features

XC5VLX50-1FFG676C features: (1)Five platforms LX, LXT, SXT, TXT, and FXT; (2)Cross-platform compatibility; (3)Most advanced, high-performance, optimal-utilization, FPGA fabric; (4)Powerful clock management tile (CMT) clocking; (5)36-Kbit block RAM/FIFOs; (6)High-performance parallel SelectIO technology; (7)Advanced DSP48E slices; (8)Flexible configuration options; (9)System Monitoring capability on all devices; (10)Integrated Endpoint blocks for PCI Express Designs; (11)Tri-mode 10/100/1000 Mb/s Ethernet MACs; (12)RocketIO GTP transceivers 100 Mb/s to 3.75 Gb/s; (13)RocketIO GTX transceivers 150 Mb/s to 6.5 Gb/s; (14)PowerPC 440 Microprocessors; (15)65-nm copper CMOS process technology; (16)1.0V core voltage; (17)High signal-integrity flip-chip packaging available in standard or Pb-free package options.

Diagrams